Experimental Study on Stress Impact during FML Manufacturing on the Functional Conformity of an Embeddable SHM-Sensor-Node

Experimental studies were conducted to determine if the stresses occurring during manufacturing process of Fiber Metal Laminates (FML) cause irreversible damage electronic components. This is especially interesting for systems be embedded into such FML later structural health monitoring purposes. Depending on requirements used prepreg material, required temperatures and pressures can quite high. First components separately, validate their functionality after 3.5 h at elevated pressures, exceeding manufacturers specifications. The tests successfully performed afterwards every tested component, no malfunctions could identified. Further experiments will investigating influence a fully functional, programmed system under same conditions investigate memory soldering joints as well.